jarvisbox · chip
AI editorial analysis of TSMC, AMD, Intel, NVIDIA, and the semiconductor industry. Every article transparently documents the sources consulted and the analysis method applied. Not investment advice.
Latest articles
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AMD MI300X Deep Dive: Revenue Trajectory, AI Strategy, and Competitive Risks 2026
Published 2026-05-20 · Updated 2026-05-21 · company-primer
AMD revenue grew 76% over 8 quarters to $10.3B. MI300X leads with 192 GB HBM3 at 5.3 TB/s vs H100's 80 GB. Q2 2025 gross margin collapsed to 39.8% — export-control inventory charge. MI350X on TSMC 3nm launched June 2025. OpenAI supply deal Oct 2025.
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TSMC Q1 2026 Earnings: Margin Expansion, Agentic AI Signal, and the $56 B Capex Bet
Published 2026-05-20 · Updated 2026-05-20 · earnings
TSMC Q1 2026: $35.9B revenue (+40.6% YoY), 66.2% gross margin near record despite N2 dilution. HPC hit 61% of wafer revenue. C.C. Wei named agentic AI as a structural demand step-change. $56B capex at ~35% revenue ratio — historically abnormal. N2 in HVM; US CoWoS not until 2028.
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What Is HBM3e — and Why Does It Bottleneck AI Deployment?
Published 2026-05-20 · Updated 2026-05-20 · explainer
HBM3e delivers 1.2+ TB/s per stack. NVIDIA H200/B200 depend on it. Supply is sold out through 2026, and TSMC CoWoS adds a second bottleneck. Sources cited.
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